Intellectual Property
900+ Filed Claims. 9 Technology Areas.
Comprehensive IP covering glass interposer impedance, hybrid bonding yield prediction, isolation synthesis, wafer control, and thermal intelligence for advanced heterogeneous integration.
Highest-Value Independent Claims
Top 10 Claims
Full claim text, evidence, and buyer-specific analysis available under NDA.
Overlay Metrology → Yield via Spatial Autocorrelation
Yield Prediction EngineBridges overlay registration measurements to hybrid bonding yield prediction via pairwise autocorrelation and spatial defect correlation length.
Relevant to: KLA, ASML
End-to-End GDS-to-Yield Pipeline for Hybrid Bonding
Yield Prediction EngineSeven-stage physics chain from CMP recess to contact mechanics to void nucleation to thermal stress to Monte Carlo yield, with mandatory data contracts between stages.
Relevant to: Corning, KLA, TSMC
Multiconductor BEM for Through-Glass Via Impedance
Glass Interposer PDKBoundary-element multiconductor capacitance extraction for TGV arrays, capturing discrete ground-via placement effects that coaxial formulas cannot.
Relevant to: Corning, Intel, Cadence, Synopsys
Bayesian Sequential Calibration of Yield Model Parameters
Yield Prediction EngineConjugate Normal-Normal sequential updates over correlation length, CMP recess variance, and anneal stress, narrowing confidence intervals by 90% within 10 measurements.
Relevant to: KLA, Corning
Closed-Loop Adjoint Workflow for Isolation Synthesis
Isolation Synthesis EngineParameterizes isolation corridors as a 2D permittivity field, runs forward FDTD with adjoint gradient computation, and exports DRC-verified GDSII in a single closed loop.
Relevant to: Cadence, Synopsys, Qualcomm, Intel
Chirped LFI Dielectric Shield
RF & Photonics SuiteChirped TiO2/SiO2 dielectric stack providing broadband laser fault injection rejection above 40 dB at 532/808/1064 nm simultaneously with visible transmittance above 90%.
Relevant to: Defense, Qualcomm, Apple
Multi-Dk Inverse Impedance Design
Glass Interposer PDKAnalytical-seed plus BEM-verify iterative search for target characteristic impedance across glass substrates of varying dielectric constant.
Relevant to: Corning, Intel, Cadence
Differentiable Yield-Aware Inverse Layout
Yield Prediction EngineFourier Neural Operator backpropagation through density, density gradient, and CMP recess channels to optimize layout density patterns for predicted yield.
Relevant to: KLA, TSMC
Spectral FFT Contact with Smoothed Dugdale CZM
Yield Prediction EngineFourier-space elastic contact combined with smoothed Dugdale cohesive zone optimization to compute wafer bonding gap and void distribution.
Relevant to: Infrastructure for hybrid bonding yield prediction
Zernike-Decomposed Iterative Learning Control
Wafer Control SuiteNoll-normalized Zernike mode decomposition with order-dependent gain scheduling for iterative wafer flatness control in lithography.
Relevant to: ASML, Tokyo Electron
Full claim text under NDA
Complete independent claim language, prosecution status, filing dates, evidence packages, and valuation analysis are available in the NDA data room.
Moat Depth
Design-Around Evidence
Each claim is backed by quantitative evidence that competitors cannot trivially replicate or circumvent the protected methods.
| Technology Area | Test | Result | What It Proves |
|---|---|---|---|
| Wafer Control Suite | ILC vs 5 classical controllers (PID, LQR, MPC, SM, Fixed) | 982/1000 wins | Control law non-trivially superior across 5 materials, 315 FEM cases |
| Glass Interposer PDK | BEM vs coaxial analytical across 41,700 TGV designs | 0/41,700 designs escape BEM | Coaxial formula is 55–225% wrong on glass TGV geometries |
| Isolation Synthesis Engine | Adjoint gradient vs finite-difference validation | r = 1.0 correlation | Adjoint gradient computation correct to numerical precision across 5 synthesis families |
| Yield Prediction Engine | Overlay autocorrelation → yield calibration | 96% CI reduction in ≤10 wafers | Correlation length converges from 294µm to 12.4µm with no competing published method |
| Glass Interposer PDK | BEM vs 5 IEEE published measurements | 3.57% MAE | Matches Eagle XG, AF32, Borosilicate, EN-A1, and Quartz within measurement uncertainty |
Portfolio Coverage
9 Technology Areas
Each area combines production solvers, validated benchmarks, and independent claims filed with a January–February 2026 priority date.
Wafer Control Suite
Iterative learning control, wafer flatness, Zernike decomposition
Package Mechanics Engine
Kirchhoff-von Karman FEM, panel warpage, structural coupling
Thermal Intelligence Engine
Binary mixture thermal, Rohsenow boiling, 2D resolved thermal
RF & Photonics Suite
TMM wideband isolation, chirped LFI shields, photonic thermal
Critical Materials Engine
PFAS remediation cascades, rare-earth selectivity
Battery Physics Engine
Gyroid tortuosity, Monroe-Newman CCD, dendrite prediction
Glass Interposer PDK
BEM multiconductor impedance, 1.6M-row database, 15+ glass types
Isolation Synthesis Engine
Adjoint topology optimization, GDSII export, DRC integration
Yield Prediction Engine
GDS-to-yield pipeline, Bayesian calibration, KLA Archer integration
Full Portfolio Under NDA
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