developer_boardBuilt for Synopsys

Glass Is the Next Interposer. No EDA Tool Supports It.

Intel Foveros 2026 and TSMC InFO-Glass 2028 are both transitioning to glass substrates. Your glass design tool coverage today: zero.

No StarRC glass parasitic model. No HFSS glass TGV library. The foundries are moving and the EDA tools have not followed. The gap is 12–18 months to replicate from scratch.

32+Production Solvers
3.57%MAE vs IEEE
1.6M+BEM Database Rows
2,055Tests Passing
157API Endpoints
909Patent Claims Filed
Market Urgency

The Foundries Are Moving to Glass

Intel Foveros Glass 2026. TSMC InFO-Glass 2028. Samsung I-Cube4 evaluating glass. The substrate transition is happening. StarRC and HFSS have silicon interposer models but zero glass models. The gap between foundry roadmaps and EDA tool coverage is widening.

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No Glass Parasitic Extraction

StarRC has no glass-specific material models. Silicon parasitic models do not transfer to glass TGV geometries.

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No Glass TGV Library in HFSS

HFSS electromagnetic simulation has no glass via library. The BEM solver could serve as a glass extraction engine.

integration_instructions

ChipletOS BEM as Extraction Engine

Integrate the 3.57% MAE BEM solver as a glass parasitic extraction backend for StarRC or HFSS glass workflows.

Integration Architecture

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BEM Impedance EngineGlass-calibrated multiconductor solver
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S2P Touchstone ExportDirect feed into HFSS 3D validation
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Pin Assignment ExportAllegro-compatible CSV with impedance targets
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157 REST API EndpointsFull programmatic access to solver stack
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1.6M+ Row Database15+ glass types, 5 metals, 10 frequency bands
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Adjoint Optimizerr=1.0 gradient correlation, closed-loop

Partnership Structures

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Licensing

License the BEM solver as a glass extraction engine embedded in HFSS or StarRC. 157 API endpoints provide full programmatic integration. Your customers get glass coverage without switching tools.

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Acquisition

Valuation, replication cost analysis, and comparable transactions available under NDA. 900+ patent claims, 1.6M+ BEM rows, 32+ solvers.

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Co-Development

Joint roadmap to build the first glass-native EDA module. ChipletOS provides the physics kernel. Synopsys provides the user interface and foundry relationships. 12–18 month head start over building from scratch.

Evidence-Backed Portfolio

Every claim is backed by reproducible benchmarks against published IEEE measurements. Full evidence package, prosecution status, and filing documentation available in the NDA data room.

Patent Claims Filed900+
Technology Areas9
Validated Solvers32+ Production
BEM Database1.6M+ Rows
Benchmark Evidence Files26
Tests Passing2,055
verifiedLive Playground

Four live demos running against the production API: impedance calculator, cheapest-50-ohm glass finder, yield risk screener, and KLA overlay bridge. No login required.

securityNDA Data Room

Full benchmark evidence, filing packages, prosecution status, and replication cost analysis. Available within 24 hours of request.

timerSub-100ms API Response

BEM impedance result in under 100 milliseconds. Coaxial approximation delta shown side-by-side. 2,055 automated tests passing.

Glass Is Coming to Your Tools. We Built the Engine.

15-minute demo or NDA data room access. Full benchmark evidence, prosecution status, and replication analysis included.