The Operating System for Chiplet Manufacturing
Predict manufacturability before tapeout. Optimize yield before the fab. Unify wafer, substrate, isolation, and bonding in one physics-native stack.
ChipletOS is the first computational platform built to model the path from wafer behavior to package yield for advanced heterogeneous integration.
Advanced Packaging Has Outgrown Traditional EDA
The move to 2.5D and 3D integration has created a gap that legacy electronic design automation tools cannot bridge. Modeling structural stress, electromagnetic coupling, and thermal warpage across disparate silicon dies requires a unified approach.
Fragmented Legacy Tools
Isolated simulators for thermal, mechanical, and signal integrity create dangerous data silos.
Unified ChipletOS Pipeline
A single physics-native kernel that handles interdependencies between bonding yield and signal loss.
“We are solving the ‘Physics of the Gap’ —the critical space between the silicon die and the final package.”
One Physics Layer Across the Full Fab-to-Package Stack
ChipletOS synchronizes data across every critical juncture of the manufacturing process.
Wafer Warpage
Kirchhoff plate FEM for wafer-level stress prediction with sub-4ms latency.
Package Warpage
Panel-level deformation modeling for assembly alignment across large-format substrates.
BEM Impedance
3.57% MAE vs 5 IEEE papers. The industry's first glass TGV impedance PDK.
Isolation Synthesis
Adjoint closed-loop optimizer. Adjoint gradient correlation r=1.0 verified against finite-difference.
Yield Prediction
GDS-to-yield pipeline for hybrid bonding. Physics + ML with KLA Archer overlay integration.
Thermal Analysis
GPU thermal modeling for H100/B200 stable operation. LBM 720,000x speedup.
EM Verification
2,434 S2P touchstone files. Full signal integrity verification across the stack.
Built for the Hardest Problems in Heterogeneous Integration
Explore Full Capabilitiesarrow_forwardGDS In, Yield Out
The only end-to-end pipeline that connects CMP recess, contact mechanics, void nucleation, thermal stress, and Monte Carlo yield in one chain. Feed in a layout, get a yield prediction before you spend $500K on a mask set.
Unified API + CLI
Control the entire physics stack through a high-performance Python API or a secure, headless Linux CLI.
Glass TGV Impedance
The only multiconductor TGV impedance tool in existence. 3.57% MAE vs 5 IEEE papers. 1.6M+ BEM rows across 15+ glass types. Coaxial approximation is 55–225% wrong on glass.
Isolation Synthesis
The only tool that designs isolation structures, not just analyzes them. Adjoint topology optimization to DRC-clean GDSII export in one closed loop.
900+ Filed Patent Claims
Comprehensive IP coverage across BEM impedance, hybrid bonding yield, isolation synthesis, and digital twin pipelines. Full portfolio under NDA.
Executive Strategic Pillars
Predict Yield Before the Fab
The only GDS-to-yield pipeline for hybrid bonding. Seven coupled physics stages predict manufacturability before you commit silicon or glass. No more $500K mask-set surprises.
Design on Glass, Not Guesswork
No EDA vendor ships a glass-calibrated impedance model. Our BEM solver is 55–225% more accurate than the coaxial approximation on TGV geometries. 1.6M+ rows, 15+ glass types.
Turn Metrology Into Revenue
Bridge overlay registration data to bonding yield predictions. Make existing KLA Archer data predict yield, not just measure alignment error. The highest-scored claim in our portfolio.
Platform Snapshot
The Software Layer for the Chiplet Era
Join the consortium of leaders redefining semiconductor manufacturing.