Foveros Glass 2026. Design Tools Ready.
The transition to glass interposers is 12 months away. No EDA vendor ships glass substrate design tools. ChipletOS does.
32+ validated solvers. 1.6M+ BEM impedance rows. 3.57% MAE against 5 IEEE papers. The only end-to-end design-to-yield platform for glass chiplet packaging.
Glass Interposers Need New Design Tools
Foveros Glass 2026 marks Intel's transition from silicon to glass interposers. But the EDA ecosystem has not kept pace. Sigrity has no glass PDK. StarRC has no glass parasitic model. HFSS has no glass TGV library. The design gap is real and the timeline is tight.
12-Month Window
Foveros Glass 2026 requires validated glass design tools that do not yet exist in any EDA vendor's roadmap.
No Glass EDA Coverage
Zero glass substrate support across Cadence Sigrity, Synopsys StarRC, and Ansys HFSS. Silicon models do not transfer.
ChipletOS: Ready Now
End-to-end glass design-to-yield platform. BEM impedance, isolation synthesis, thermal analysis, and yield prediction in one stack.
Foveros Glass Design Stack
Strategic Advantage
First-Mover IP
900+ filed patent claims across 9 technology areas. 12–18 months to replicate from scratch. The glass design tool IP position is uncontested.
EDA Integration Ready
157 API endpoints. Allegro pin export, S2P touchstone output, HFSS validation workflow. Drop into existing Intel design flows.
Production Validated
2,055 automated tests passing. 982/1000 ILC controller wins. Bayesian yield calibration converging in 10 wafers to CI<20μm.
Platform at a Glance
Until Foveros Glass 2026 — Design Tools Needed Now
EDA Vendors with Glass Substrate Design Coverage
Only End-to-End Glass Design-to-Yield Platform
Foveros Glass Needs Design Tools. We Built Them.
Acquisition, licensing, or partnership — we are open to all structures. 15-minute demo or NDA data room access available immediately.