The Platform for
Heterogeneous
Integration.
ChipletOS is the unified software coordination layer for next-generation semiconductor manufacturing, orchestrating physics-aware design and yield management across the entire silicon lifecycle.
Modular Manufacturing Subsystems
Glass PDK (Interposer)
The industry's only glass TGV impedance PDK. BEM solver with 3.57% MAE vs 5 IEEE papers, 1.6M+ database rows, 2,434 S2P files, and 15+ glass substrate types.
Bondability (Yield)
Physics + FNO yield prediction pipeline with KLA overlay integration and Bayesian calibration. 85.6% mean yield prediction.
IsoCompiler (EM Isolation)
Adjoint topology optimizer for EM isolation synthesis. 0/20 alternative approaches beat the closed-loop pipeline. r=1.0 correlation.
Packaging OS (Substrate)
Warpage prediction and multi-die assembly management. Kirchhoff FEM with sub-4ms latency and rectangular plate immunity.
Fab OS (Wafer)
ILC Zernike controller for wafer-level lithography correction. 982/1000 wins vs PID/LQR/MPC/SM/Fixed baselines.
Thermal Core
GPU thermal modeling (H100/B200 stable). LBM solver with 720,000x analytical speedup. Honest about Marangoni gap in solutal modeling.
Precision Engineering
Across the Stack
Detailed workflows from pre-tapeout physics to final-yield substrate validation.
Manufacturability before Tapeout
- check_circleWafer mechanics & stress simulation
- check_circlePanel flexure prediction models
- check_circleDRC-aware EM isolation logic
Yield before the Fab
GDS-to-yield pipelines powered by contact physics and hybrid bonding validation.
View Validation Data open_in_newElectrical Substrate Physics
Deep integration for glass interposers and TGV architectures. We provide full-wave BEM impedance extraction and localized dielectric mapping.
Unified Access Layer
Control complex manufacturing hardware through a single, idempotent interface. ChipletOS treats physical machines as logical compute nodes.
import chiplet_os as cos
platform = cos.init("FAB_01_WEST")
# Orchestrate heterogeneous bonding
recipe = cos.Workflow(die_type="HBM3", substrate="Glass_2.5D")
recipe.apply_thermal_profile(cos.Physics.ISO_77)
platform.execute(recipe)
print(f"Current Yield: {platform.stats.yield_p99}%")
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Validation & Precision
Computational Validation
2,055 automated tests across the full solver stack. Reproducibility scripts and raw benchmark data included in the NDA evidence package.
Predictive R² Metrics
BEM surrogate achieves R² = 0.99997. FNO yield screening model at R² = 0.50 pixel / 0.63 image-max on 20,000 held-out test samples.
Lab-Ready Templates
Direct integration with VNA (Vector Network Analyzer), SAM (Acoustic Microscopy), and CHF systems.
ChipletOS vs Industry Tools
| Feature | ChipletOS | Cadence Sigrity | Synopsys | Ansys HFSS |
|---|---|---|---|---|
| Glass TGV PDK | ✓ (only one) | ✗ | ✗ | ✗ |
| BEM Impedance | 10ms | 3D FEM (hours) | N/A | 3D FEM (hours) |
| Glass Material DB | 1.6M+ rows | Manual input | N/A | Manual input |
| S2P Library | 2,434 files | Generate yourself | N/A | Generate yourself |
| Yield Prediction | Physics + FNO | ✗ | ✗ | ✗ |
| Isolation Synthesis | Adjoint closed-loop | ✗ | ✗ | Manual sweep |
| End-to-End Pipeline | 1 API call | ✗ | ✗ | ✗ |
Scale Your Heterogeneous Roadmap
Join the industry leaders moving from monolithic designs to high-yield chiplet architectures with ChipletOS.